2023-08-09 19:10:00
Artificial intelligence fever is pushing production of certain types of chips, including high-bandwidth memory (HBM). According to TrendForce’s forecast, by 2024 its production will have doubled, which is the memory used by the processors (both CPU and GPU) most suitable for artificial intelligence. Beyond this, manufacturers of those processors are also trying to increase production of advanced encapsulation methods.
The production of this HBM is transitioning to the HBM3 during this year, since it is expected to be 39% of the total compared to 8% that it represented last year, and 60% that is expected to be next year. By manufacturers, production will continue to be dominated by SK Hynix and Samsung, dividing it up equally, because Micron will lower its share from the current 4-6% to 3-5% in the best case. The other two will have 47-49% of production.
During 2024 the price of the HBM prior to the third generation will drop, although the price of the HBM3 will remain the same. By 2024 HBM’s production will have increased by around 105%, although due to the specific equipment needed for its production it will not materialize until at least the second quarter of the year. That equipment is mainly for the creation of the vias through the silicon that is used to join the layers of HBM. Since the AI fever has only started a few months ago and it takes around a year to deliver new equipment for it, this is what will lead to production doubling by Q2 2024 instead of the beginning of the year. Of course, Samsung and SK Hynix are engaged in this aggressive increase.
Via:
TechPowerUp.
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