With PCIe 5.0 hardware platform, when will SSD arrive? In addition to the continued improvement in performance, what else will be changed?
In an interview, Phison CTO Sebastien Jean focused on power consumption and heat generation.
He pointed out: “We have done a lot of work to make sure that SSD power consumption is within a reasonable range, but there is no doubt that SSDs are going to get hotter, just like CPUs and GPUs started to get hotter in the 1990s. To PCIe 5.0 In the era of /6.0, we have to consider active cooling.”
In his opinion, PCIe 5.0 SSDs must be equipped with large heat sinks, but ultimately have to rely on active fans to quickly dissipate heat.
In fact, there are already SSD coolers with their own fans, but they are not necessary, and the PCIe 5.0 era is different.
Sebastien Jean revealed that the SSD master controller can withstand a high temperature of 120 °C, but this will seriously affect the flash memory wafer. If the temperature of the latter reaches about 75 °C, it will become very unreliable, and it is easy to slow down or even lose data.
Under reasonable circumstances, the temperature of the flash wafer should be in the range of 25-50°C.
In order to solve these problems, Phison is also trying various efforts, including upgrading the main control process, such as the use of the new 7nm, which can greatly reduce heat generation and reduce the wafer area, but at the same time, the flash memory process must also be upgraded simultaneously.
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