UCIe is a project that standardizes the chip mix. The standard will provide standardization of physical layer, protocol stack, software model and regulatory compliance check to make it easier for companies to buy and sell chips.
The three most powerful chipmakers in the world, Samsung, TSMC and Intel last week confirmed their commitment to set a single standard for next-generation chip packaging technologies in what could be an example of what is known as the Chip 4 Alliance as the US government seeks to develop to establish full chip supply chain networks between countries with shared values.
“Samsung Electronics sees Chiplet as the future (of chips),” said Han Jin-man, senior vice president of Samsung Electronics’ memory business during the Intel Innovation event, which took place in the US. “We will support heterogeneous computing through an ecosystem of chips”.
Chiplet Han refers to the Universal Chiplet Interconnect Express (UCIe) created by technology leaders to standardize chip integrations in chipsets.
Kevin Zhang, senior vice president of business development at TSMC, also expressed open support for the standard, saying that TSMC’s goal is to provide an open chip platform.
Intel CEO Pat Gelsinger said in his keynote speech that “UCIe is now becoming a reality”, noting that the top three chip companies and more than 80 other companies in the semiconductor industry have joined the UCIe consortium.
The CEO promised that its chip manufacturing unit, Intel Foundry Services, will lead the way in creating a new era called a “systems factory” based on four main components – wafer manufacturing, packaging, software and an open chip ecosystem. “Innovation that was once considered impossible has opened completely new possibilities for chip manufacturing,” he said.
Chiplet’s idea arose to solve the problem of complexity arising from the transition to manufacturing technologies. A chip is an embossing with a small function loaded on a square of material from which the chip is made. Companies used to focus on producing large DIES, but now they are changing direction to connect many DIES. The idea of a chiplet was published in 1965 by one of the founders of Intel Gordon Moore. UCIe is a project that standardizes the chip mix. The standard will provide standardization of physical layer, protocol stack, software model and regulatory compliance check to make it easier for companies to buy and sell chips.