The company reports that Cadence’s EDA and IP solutions have been optimized For Intel’s process and packaging technologies
Cadence Design Systems (Cadence) announces that it has joined Intel’s new founding partner program (Intel Foundry Services) to support the joint ventures of the two companies in developing and providing innovative SoC designs. As a member of the IFS program, Cadence promotes the adoption of Intel’s process and packaging technologies, as well as the adoption of Cadence’s advanced verification, EDA and IC Packaging solutions, together with the Planning, Verification, and Tensilica portfolio.Ò IP. With the help of Intel and Cadence technologies, customers can accelerate market entry time while reducing design barriers, risks and costs.
Joining the IFS program has a number of benefits: Cadence will have early access to process and IC packaging roadmaps, process planning kits (PDKs) and technical training. This will allow Cadence’s research and development teams to adapt the EDA and IP tools to Intel’s process and packaging technologies so that its customers can meet the performance requirements for the Performance Unit (PPA).
“We partner with world-leading partners like Cadence to ensure our customers enjoy access to a strong and comprehensive ecosystem of design, process technologies, packaging technologies and advanced manufacturing capabilities,” he said. Dr. Randir Takur, President IFS At Intel. “Cadence is constantly developing new solutions and IP to meet all customer requirements, making it a critical partner in the ecosystem that is well-suited to our mission – to meet the growing global demand for chips with groundbreaking technologies for SoC design.”
Dr. Anirod Debgan, President and CEO of Cadence: “Our customers are under great pressure to provide SoC systems that will be energy efficient and meet performance requirements. The collaboration between Cadence and Intel Foundry Service enables our customers to deliver innovation safely. ”