It was revealed that Vice President Lin Jun-cheng, a former TSMC member who was recruited by Samsung Electronics’ semiconductor division to strengthen cutting-edge package technology, left the company when his contract expired at the end of last year.
According to the industry on the 1st, Vice President Lin left the company on December 31 last year when his contract with Samsung Electronics’ Device Solutions (DS) division expired.
Vice President Lin is an expert who worked at TSMC for about 19 years and developed packaging technology, and was hired the following year after establishing the Advanced Packaging (AVP) business team within the DS division at the end of 2022.
Samsung’s foundry (semiconductor consignment production) division has focused its efforts on the advanced packaging sector as one of the breakthroughs to surpass TSMC.
In July of last year, Vice Chairman Jeon Young-hyun reorganized the AVP development team and placed it under the vice president’s direct control through his first reorganization since taking office as head of the DS division. At the time, it was known that the reorganization was intended to speed up the development of 3D packaging technology, a key future technology.
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