Intel IEDM 2023 Conference: Advanced 3D Layered CMOS Transistors and Power Supply Innovations

by time news

2023-12-10 00:39:00
Intel Makes Groundbreaking Advances at IEDM 2023 Conference

At the 2023 IEEE Electronic Devices and Devices Conference (IEDM), Intel presented groundbreaking advances in the semiconductor industry that promise to extend Moore’s Law and drive future computing innovations.

During the conference, Intel researchers showcased innovative 3D layered CMOS transistors combined with back-of-chip power delivery and direct surface contacts. According to Paul Fisher, Director of Microchip Manufacturing Processes at Intel, these advances mark a significant milestone in transistor architecture technology that will help meet the growing demand for more powerful computing.

The company’s commitment to innovation was evident as the Components Research Group at Intel revealed its dedication to finding new ways to put more transistors on silicon while achieving higher performance. Intel is working to extend Moore’s Law to a trillion transistors on a chip by 2030, demonstrating its dedication to driving the semiconductor industry forward.

Additionally, Intel presented recent transistor research that showcased the ability to vertically layer complementary field transistors with a fragmented gate pitch of 60 nm. This process allows for increased space efficiency and performance benefits by layering transistors, a significant technological achievement for the industry.

Furthermore, Intel is making strides in integrating silicon with gallium nitride (GaN) transistors on the same 300 mm wafer, highlighting its commitment to performance improvements and sustainability in semiconductor manufacturing.

Overall, Intel’s research and development in the field of the two-dimensional transistor, particularly in transient dichalcogenide-based 2D channel materials, offers a unique opportunity for sub-10 nm fragmented physical gate length, promising continued advancements in transistor technology.

As Intel continues to drive innovation at the forefront of the semiconductor industry, the groundbreaking advancements presented at IEDM 2023 highlight the company’s dedication to driving Moore’s Law forward and shaping the future of computing.
#Intel #presents #breakthroughs #shortening #transistors #continue #production #future #nodes

You may also like

Leave a Comment