Intel will build a chip packaging factory in Italy with an investment of 5 billion euros

The Italian government will finance up to 40% of the costs

Intel and Italy are close to agreeing on a deal to build a $5 billion chip assembly and packaging plant in the country, with the Italian government financing up to 40% of the costs. This is according to a news article published this week on the Reuters website.

Instead of a semiconductor manufacturing plant, Intel Italy’s new facility will work on chip packaging. According to the Reuters report, the process will be carried out using “new technologies for cutting full chips from wafers”. Two potential sites, in Piedmont and Veneto, have been shortlisted.

Italy will join Germany, Ireland and France and bring Intel’s total investments in Europe to 80 billion dollars.