Intel’s Advancements in Wafer Foundry Business and Future Plans

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2024-04-04 05:57:57

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2024-04-04

Intel said that the 14A process can lead the way in all aspects
Received 5 18A orders totaling US$15 billion in contracts

Text: Editorial Department/News Center

[㊙️]Foreign media reported that Intel announced more wafer foundry business progress on the 3rd, stating that it has received a total of 5 orders for the 18A process with a contract price of approximately US$15 billion, and is in the process of processing dozens of chips of different designs. Production testing, it is expected that the first 18A process chip will be trial-produced in 2024.

Intel’s CEO also compared the technical advantages and disadvantages of its own different process foundries with those of its market competitors. It can be seen that Intel 7 process foundry has lagged behind its competitors in the market.

Although Intel 3 process foundry is equal to its competitors in terms of performance and power consumption, it is still at a disadvantage in terms of chip density and cost. Therefore, Intel will focus on the 18A process. Intel revealed that 18A foundry can achieve better results in terms of chip density and cost. Tied with TSMC 2nm process, and has a slight lead in performance and power consumption.

It is worth noting that Intel’s 7 to 18A process OEMs are all aimed at HPC high-performance chips, but after Intel enters the 14A process, it will be able to meet the needs of low-power chips in the mobile phone/mobile device market at the same time. The 14A process is expected to debut in 2026 .

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