[다시 짙어진 ‘반도체 겨울’]
Samsung HBM issue mentioned for the first time at CES
“Samsung Electronics’ high bandwidth memory (HBM) is currently being tested and we are confident it will be successful.”
At a meeting held at the Fontainebleau Hotel in Las Vegas, USA on the 7th (local time), NVIDIA CEO Jensen Huang (pictured) answered questions from reporters asking about the status of HBM 5th generation (HBM3E) cooperation with Samsung Electronics. CEO Hwang said, “I have no doubt that tomorrow (the 8th) is Wednesday,” and added, “Samsung was the first to supply HBM to Nvidia, and as it is a great memory company, it will recover.”
The meeting on this day was a question and answer (Q&A) session following CEO Hwang’s keynote speech at CES, the world’s largest information technology (IT) and home appliance exhibition, the previous day. This is the answer given while there is no news yet that Samsung Electronics’ HBM3E is installed in NVIDIA’s artificial intelligence (AI) super chip ‘Blackwell’.
On the other hand, SK Hynix’s HBM3E passed the test and began mass production and supply in March of last year. HBM is a cutting-edge memory semiconductor that dramatically increases calculation speed by stacking multiple DRAMs vertically. The AI chip made by NVIDIA consists of a processor and several HBMs, which are data processing devices.
However, CEO Hwang pointed out that “a new design is needed” for Samsung Electronics’ HBM3E. This is the first time that CEO Hwang mentioned problems with Samsung Electronics’ HBM3E in an official setting. CEO Hwang announced in March last year that Samsung Electronics’ HBM3E was “under testing.” Since then, I have not been able to pass the test for about 10 months until January of this year. In response to criticism that Samsung Electronics’ HBM3E test was taking too long, CEO Hwang said, “Korea is too impatient,” and “It’s not taking that long.”
According to the semiconductor industry, NVIDIA is reportedly requesting that Samsung Electronics’ HBM3E improve its heat generation and power efficiency. As Blackwell’s performance is superior to that of the previous generation ‘Hopper’ series, the key is to control heat generation by using a huge amount of power. If heat is not properly controlled, semiconductor performance may not be performed properly or product aging may occur.
CEO Hwang also announced plans to meet with SK Group Chairman Chey Tae-won. When asked if he would meet Chairman Choi during CES, CEO Hwang said, “I think so.” It is known that Chairman Choi plans to visit Las Vegas to observe CES. It is expected that discussions will be held on strengthening AI-related cooperation, including HBM. In his keynote speech the day before, CEO Hwang declared the ‘popularization of robots’ and announced that he would launch an AI development platform for robots and autonomous driving.
Las Vegas = Reporter Park Hyun-ik [email protected]
-
- great
- 0dog
-
- I’m sad
- 0dog
-
- I’m angry
- 0dog