Qualcomm announces the technologies that will carry the mobile phones of the future at MWC 2024 – 2024-05-08 03:50:13

by times news cr

2024-05-08 03:50:13

Qualcomm has presented a series of new developments related to AI and Wi-Fi and 5G connectivity during the Mobile World Congress in Barcelona. The American company has launched a artificial intelligence model library optimized for smartphones called AI Hub, as well as a new modem Snapdragon X80 that combines AI and 5G and a new platform named FastConnect 7900 that integrates Wi-Fi, Bluetooth and ultra-wideband technology on a single chip.

AI Hub It is, without a doubt, one of Qualcomm’s most interesting developments in terms of AI. It is, we reiterate, a library that allows developers to access more than 75 AI models optimized for the Snapdragon and Qualcomm platforms.

Some of these models are developed by large companies specialized in AI. Among them, for example, is Stable Diffusion, which are intended for the generation of images. What is relevant about AI Hub is that the different AIs have additional privacy and security measures, as well as greater customization options, says Qualcomm.

The goal of AI Hub is that developers can integrate AI functions into their applications. Qualcomm, in fact, allows them to access the different models through Hugging Face and GitHub. IA Hub will be available soon, and it is now possible to register so that developers can access the library before anyone else. The firm has also confirmed that new models will be added progressively.

In parallel, Qualcomm has announced the Snapdragon X80 modem, a modem-RF 5G intended for 5G Advance and which, in addition, is compatible with connections NB-NTN satellite. The Snapdragon X80 is also powered by AI to optimize the connection and offer stable connectivity even in areas where there is little coverage.

Qualcomm has also confirmed that this modem will not only be available for smartphones, but also for computers and other devices, such as computers, mixed reality products, etc.

Lastly, the company has also announced the plataforma FastConnect 790, which is capable of integrating Wi-Fi 7, Bluetooth and 5G connections on the same chip made of 6 nanometers. This chip also integrates AI to learn from the user’s uses and ensure good connectivity at all times.

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