2023-08-17 22:36:00
3D NAND chip makers are in a cesspool where billions of losses are being left behind quarter by quarter, although they are slowly starting to climb out of it. In the case of Samsung it has not been different, but the development of new technologies must continue because better times will come. That happens through the V-NAND chips, as he calls his 3D NAND, with more than three hundred layers. It would be preparing to start its production in the second half of 2024.
It would preempt SK Hynix in that mass production, which has already developed a 321-layer chip, but will not go into production until the first half of 2025. Samsung would maintain the use of a double-stacked production process, which it has cost advantages over SK Hynix’s method, but to go beyond 400 layers it is expected to use a triple chip-stacking process, which will increase costs. Samsung expects to exceed 1,000 layers per chip of V-NAND by 2030.
Via:
Tom’s Hardware.
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