January 26, 2022
The technology was developed at the American subsidiary Intrinsix and adopted by Lockheed Martin and Intel, which is assisted by the US Department of Defense’s case development program.
CEVA (CEVA) has announced the expansion of its hardware security solutions through the development of a secure communication channel that connects the separate chips (chiplet) that house a multi-chip component (Heterogenous System on Chip – HSoC). The new solution, Fortrix SecureD2D, Was developed by the American company Intrinsix, which was acquired by Siva in June 2021 for about $ 33 million.
The use of components based on different chip arrays is growing. According to Gartner, sales in the field are expected to grow from about $ 3.3 billion in 2020 to about $ 50.5 billion in 2024. The main impetus for the use of chip arrays (HSoC) is the need to produce very large chips that are difficult to apply in a single silicon wafer, and the need to build on-chip (SoC) systems that include various components, such as analog, digital, memory, power or RF components. Each of which has a different optimal production technology.
The main difficulty lies in the fact that during HSoC development, companies use separate chips coming from different sources and therefore do not have full control over their level of security and performance. Secure communication between chips is therefore a vital need in the aerospace and defense industries, the automotive market and IoT applications. The Fortrix SecureD2D solution addresses the issue through a series of microcontrollers, including a RISC-V-based processor and a secure SPI channel, which manage a secure and encrypted communication fabric within the component.
Siva said the technology was adopted by Lockheed Martin and “a leading chip company as part of a U.S. Department of Defense development program.” Because the US Department of Defense’s program is a State-of-the-Art Heterogeneous Integrated Packaging – SHIP program, Intel is a company that received a budget of about $ 173 million by the end of 2020 to develop technological demonstrations of secure HSoC arrays.
“Fortrix SecureD2D technology enables high-level security between chipsets and paves the way for the Department of Defense to accelerate design processes and reduce chipset development costs,” said Mark Bill, chief technology officer at Intersix Division. “Our technology is available as part of a U.S. Department of Defense development program that will help secure next-generation chips.”
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Posted in tags: HSoC, SoC, Intel, Siva
