2023-12-30 03:00:00
JEDEC Announces Launch of CAMM2 Memory Module Standard
The JEDEC Solid State Technology Association recently made waves in the consumer electronics industry with the announcement of the CAMM2 memory module standard. This new standard aims to improve the existing SODIMM form factor and provide soldered RAM, all while maintaining signal integrity, density, and a compact form factor.
The CAMM2 standard comes in two variations: DDR5 CAMM, designed for high-performance notebook and potential desktop computers, and LPDDR5/LPDDR5X CAMM, suitable for thin notebook computers and certain servers. It is important to note that the electrical pins for each type of CAMM are incompatible with each other, and there are mechanical differences in place to prevent incorrect installation.
In addition, JEDEC also revealed that the CAMM2 standard will support stackable CAMM2: dual channel (DC) and single channel (SC). This innovative design allows for flexibility in memory capacity, with the potential for future multi-channel setups. Mian Quddus, Chairman of the JEDEC Board of Directors, emphasized the organization’s commitment to providing innovative standards to the industry and praised CAMM2 for its flexibility and future scalability.
The launch of the CAMM2 memory module standard marks a significant advancement in memory technology, and the industry is eager to see the impact it will have on future consumer electronics. With improved form factors and enhanced performance capabilities, CAMM2 has the potential to revolutionize the way we use and upgrade memory modules in our devices.
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