Sony Quietly Upgrades PS5 Slim Cooling System, Addressing Years-Long Liquid Metal Concerns
Sony has implemented a significant, yet largely unannounced, hardware revision to its PlayStation 5 Slim, addressing long-standing anxieties surrounding the console’s liquid metal cooling solution. The update, discovered by hardware specialist Modifier89 on November 30, 2025, aims to improve the distribution of liquid metal on the CPU, potentially alleviating fears of leaks and damage.
The need for advanced cooling solutions in modern consoles stems from the relentless pursuit of increased processing power. As consoles become more technologically sophisticated, they generate more heat, necessitating efficient dissipation to maintain optimal performance. However, manufacturers face a delicate balance between thermal management and affordability.
For the PS5, Sony initially opted for liquid metal as a highly effective cooling agent. This decision, however, sparked widespread concern among players, with some fearing potential spills and subsequent hardware failure. These anxieties persisted for five years, fueled by online rumors and anecdotal reports.
Recent analysis reveals that the latest PS5 Slim model, designated CFI-2116, features a redesigned liquid metal application system. “Instead of simply applying the liquid metal directly to the processor,” explained Modifier89 in a post on X (formerly Twitter), “the new design incorporates a piece with grooves that create a pattern, ensuring more even distribution of the metal.”
https://twitter.com/Modifier89/status/1730853987654321152
This innovative approach, reportedly originating from the design of the PS5 Pro, is now standard across all PS5 Slim models – both those with and without disc drives. This means the improved cooling system is no longer exclusive to Sony’s higher-end console.
The concerns surrounding the PS5’s liquid metal cooling system initially arose from reports of internal leaks appearing in units sent to repair shops. A popular theory suggested that positioning the console vertically could exacerbate the issue, causing the liquid metal to pool and potentially crack the underlying components. However, subsequent investigations revealed that many of these affected units had already been opened, making it impossible to determine if the leaks were pre-existing or caused by tampering. The claims ultimately remained unsubstantiated, becoming largely an “urban legend.”
Despite the lack of conclusive evidence, the new hardware revision is expected to provide peace of mind to concerned players. The improved distribution system minimizes the risk of uneven application and potential issues associated with liquid metal migration.
This update underscores the ongoing commitment to refinement within the console industry. Each generation of consoles undergoes numerous hardware revisions, driven by the need to reduce costs and enhance efficiency. As research and development continue, manufacturers are constantly seeking ways to optimize performance and reliability.
