Dublin, February 29, 2024 – Data centers, the backbone of our digital world, are facing a critical challenge: keeping cool. As demand for computing power surges,conventional cooling systems are struggling,and countries are beginning to take notice,with Ireland recently introducing restrictions on new data center builds due to their growing energy demands. though, a new solution could dramatically reduce energy use and extend the life of computer chips.

  • A new passive cooling system,developed through the AM2PC project,has exceeded performance targets by 50 percent.
  • The system utilizes a two-phase cooling process,eliminating the need for energy-intensive pumps and fans.
  • Excess heat generated can be repurposed for district heating or industrial applications.
  • The cooling component is 3D-printed from a single, recyclable material, reducing manufacturing waste.

The breakthrough comes from the recently completed AM2PC project, led by the danish Technological Institute and Heatflow, with partners from Belgium and Germany. The team designed and rigorously tested a 3D-printed cooling component specifically for data centers and high-performance computing systems.

Cooling Without the Energy Drain

Unlike conventional air cooling, which relies on fans and energy-guzzling compressors, this new system employs passive two-phase cooling based on the thermosiphon principle. A coolant evaporates at the hot surface of the chip, naturally rises, condenses while releasing heat, and then returns as liquid through gravity – all without requiring pumps or fans. This approach is demonstrably more efficient then air or single-phase liquid cooling, and crucially, doesn’t add to the energy bill for heat transport.

“Besides the actual IT hardware, the corresponding cooling infrastructure is one of the major energy consumers in a data center – and therefore the greatest potential to improve overall system efficiency,” explains Simon Brudler, 3D-printing specialist and senior consultant at Danish Technological Institute.

The urgency for better cooling solutions is escalating alongside the increasing power demands of GPUs. Just a few years ago, GPUs typically consumed between 100 and 200 watts. Today, that figure has climbed to several hundred watts, and in certain specific cases, even exceeds a kilowatt.

“We are seeing a development where the power density in servers is increasing faster than ever before, and traditional air cooling is simply no longer sufficient. With our two-phase solution, we can remove heat passively without pumps or fans, which significantly reduces the energy consumption for cooling,” says Paw Mortensen, CEO of Heatflow.

Turning waste Heat into a Resource

At the heart of the system is a 3D-printed aluminum evaporator, a collaborative creation of Heatflow and the Danish Technological Institute. Utilizing additive manufacturing allowed the team to integrate all necessary functions into a single, streamlined component.

“By 3D printing the component in aluminium, we can integrate all necessary functions into a single part. This eliminates assembly points,reduces the risk of leaks,and makes the component more reliable,” explains Brudler.

The system efficiently removes heat at temperatures between 60 and 80 degrees Celsius. This temperature range is ideal for direct integration into district heating networks without any additional energy input. It could also be utilized in industrial processes within sectors like food production, textiles, paper manufacturing, or greenhouse agriculture, provided these facilities are located in close proximity to the data center.

Traditional air cooling typically operates at lower temperatures, severely limiting opportunities for heat reuse. While the project’s primary focus wasn’t district heating integration, researchers confirmed the technology readily enables