This is a technological combination that allows the integration of a large number of optical fibers into a chip, providing a solution for server farms and communication infrastructures
Tower Semiconductor, a supplier of technological solutions and manufacturing platforms for analog chips, and Teramount, which specializes in the packaging of silicon photonics fibers and the developer of the PhotonicPlug, announced today (Monday) a new technological collaboration that enables the integration of a large number of optical fibers into chips.
This development is based on Tower’s silicon photonics platform in combination with the ‘PhotonicPlug’ developed by Tramount, which create a unique and innovative solution for optical connectivity to transmit information at high speeds for server farms, advanced communication infrastructures that transmit information at high bandwidth, and also for various applications in the field of artificial intelligence and smart sensors. The new development simplifies the complex process of this type of chip package and offers a number of other prominent competitive advantages in this field while adapting it to mass production.